The Automatic Degluing Machine removes glue from sliced silicon wafers to complete the separation of silicon wafer and bonding board. The machine features manual trailer loading and automatic loading of the lower trough, with a maximum lifting weight of ≤200Kg. It is adaptable to be compatible with various crystal trays from 800-1000×300×250. Batch completion time is <6-10min/batch (user-defined, adjustable). The tank and side walls can be flushed directly with water for easy maintenance.